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Contents

Electronic Devices

PN Junction

PN Junction Basics Forward and Reverse Bias Diode Equation Junction Capacitance Breakdown Mechanisms Small Signal Model

BJT Fundamentals

BJT Operation BJT Configurations Current Components Ebers-Moll Model Transistor Switching

FET Fundamentals

JFET Basics MOS Capacitor MOSFET Structure MOSFET Operation MOSFET I-V CMOS Basic

Special Devices

Zener Diode Tunnel Diode Varactor Diode Schottky Diode UJT

Optoelectronics

Light Emitting Diodes Photodiodes Solar Cells Laser Diodes Fiber Optic Sources Phototransistors Optocouplers

Power Devices

Power Diodes Power MOSFETs IGBTs Thyristors GTO and TRIAC

Other Topics

IC Fabrication Basics Nanoelectronics Intro MEMS Single Electron Transistor

Other Subjects

Analog Electronics Digital Electronics Signals & Systems Control Systems Electromagnetic Theory Digital Communication Analog Communication Network Analysis Microprocessors VLSI Design Verilog HDL Power Electronics Embedded Systems DSP

Section Progress25%

1 of 4 articles

IC Fabrication Basics

Lithography, etching, deposition steps.

Updated: 19 March 2026

5 min read

IC Fabrication Steps

Assess lithography, etching, and deposition processes.

Question 1 of 3

Q1.What happens to a positive photoresist material when exposed to ultraviolet light during the lithography process?

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